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VERFAHREN ZUM DUENNAETZEN VON SUBSTRATEN

Process for the chemical thinning of substrates
 
: Haberger, K.; Buchner, R.; Bollmann, D.

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Frontpage ()

DE 1990-4021541 A: 19900706
DE 1990-4021541 A: 19900706
EP 1991-911272 A: 19910627
DE 4021541 C1: 19911219
EP 538279 B1: 19940720
H01L0021
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
In a process for the chemical thinning of etching substrates by means of chemical etchant, a predetermined thickness of a monocrystalline substrate with an undisturbed grating structure is retained by irradiating the substrate during the etching process by a radiation source with a beam impinging perpendicularly to the substrate surface, the substrate consisting of a material capable of absorbing the radiation, the wavelength of the main part of the beam being selected such that the absorption length of radiation in this wavelength in the substrate material is greater than the desired substrate thickness.

: http://publica.fraunhofer.de/documents/PX-38805.html