Verfahren zum Anbringen eines Bauelements an einem plattenfoermigen Traeger
Date Issued
1998
Author(s)
Azdasht, G.
Kasulke, P.
Patent No
1997-19719860
Abstract
The component mounting method is used for attaching an electronic component (10) to the surface of a carrier plate (12,18), with a solder layer inserted between the component and the carrier plate surface. An optical fibre or optical fibre bundle is applied to the opposite side of the carrier plate and supplied with a laser light pulse provided for melting the solder layer, to provide a mechanical and electrical connection between the component and the carrier plate. USE - For attaching laser diode to Cu coated circuit board. ADVANTAGE - Reduced thermic loading of electronic component.