Verfahren und Vorrichtung zur Montage von elektronischen Bauelementen auf einer Leiterplatte
Date Issued
2000
Author(s)
Schweigert, U.
Patent No
1989-3914462
Abstract
A description is given of a process and a device for assembling electronic components, which are fed individually, on a printed circuit board using a gripper which grips the components by the body and/or leads and inserts the leads of the component into assigned holes on the printed circuit board by means of a traversing movement relative to the printed circuit board. A characteristic feature of the said invention is that a quick-setting adhesive is applied to the base of the component to fix the component in position until soldering is carried out.