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  4. Verfahren und Vorrichtung zur Montage von elektronischen Bauelementen auf einer Leiterplatte
 
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Patent
Title

Verfahren und Vorrichtung zur Montage von elektronischen Bauelementen auf einer Leiterplatte

Other Title
Process and device for assembling electronic components on a printed circuit board
Abstract
A description is given of a process and a device for assembling electronic components, which are fed individually, on a printed circuit board using a gripper which grips the components by the body and/or leads and inserts the leads of the component into assigned holes on the printed circuit board by means of a traversing movement relative to the printed circuit board. A characteristic feature of the said invention is that a quick-setting adhesive is applied to the base of the component to fix the component in position until soldering is carried out.
Inventor(s)
Schweigert, U.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=3914462A
Patent Number
1989-3914462
Publication Date
2000
Language
German
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