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Title
Verfahren und Vorrichtung zur Ausbildung einer erhoehten Kontaktmetallisierung
Date Issued
1996
Author(s)
Zakel, E.
Nave, J.
Eldring, J.
Patent No
1995-95086775
Abstract
Process and device for the formation of a raised contact metallization (18) on a terminal area (11) of a substrate (10) using a wire bonding facility with a bonding tool (26), whereby firstly the end piece of a contact material wire (13) projecting from a mouthpiece (27) is connected with the terminal area (11) by means of a bonding tool (26); this is followed by the wire end piece (29) connected to the terminal area (11) being cut off from the rest of the contact material wire (13), said process comprising the following steps: - Performance of a first connection between a free end of the wire end piece (29) and the terminal area (11) in order to form a first connection area (21), - Performance of a second connection between a continuous end of the wire end piece (29) connected to the rest of the contact material wire (13) and the terminal area (11) or a partial area of the wire end piece (29) already connected by one end to the terminal area (11) in order to form a second area (22), i n such a way that a defined wire section (19) is formed between the first connection area (21) and the second connection area (22) and the connection areas (21, 22) form a contact material volume (25) together with the wire section (19), - Melting of the contact material volume (25) formed on the terminal area (11) in order to form the raised ...
Language
de
Patenprio
DE 1995-95086775 A1: 19950310