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Verfahren und Vorrichtung zur Applikation von Verbindungsmaterial auf einer Substratanschlussflaeche

Process and device for the application of connecting material on a substrate terminal area
 
: Zakel, E.; Eldring, J.; Jung, E.

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Frontpage ()

DE 1994-4432579 A1: 19940913
DE 1995-19533171 A: 19950908
DE 19533171 A1: 19960314
H01L0021
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
Process and device for the application of lumpy, in particular ball-shaped connecting material (11) onto a substrate terminal area (12), whereby the connecting material is taken up by a placing device (14) and is then placed on the substrate terminal area, whereby , prior to the placing device (14) placing the connecting material (11), the connecting material is separated and centred in relation to the placing device.

: http://publica.fraunhofer.de/documents/PX-38598.html