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Verfahren und Vorrichtung zum Ueberpruefen der Verbindungen gebondeter Wafer

Process and device for the inspection of the connections of bonded wafers
: Bollmann, D.

Frontpage ()

DE 1995-19525769 A: 19950714
DE 1995-19525769 A: 19950714
DE 19525769 C1: 19960829
Patent, Electronic Publication
Fraunhofer IZM ()

In a process for the inspection of the connection of at least two interconnected wafers, the connected wafers are irradiated with an infrared radiation mainly perpendicular to the main surfaces of the same. The transmitted infrared radiation is recorded as an image. Depending on the intensity of the detected radiation, a grey-scale value is assigned to each pixel in the image. A probability value is calculated for each pixel in the image by means of an evaluation of the grey-scale values of all the pixels in the image based on a typical distribution of grey-scale values. A results image, which is suitable for display on a printer or a monitor screen, can be generated based on the probability values.