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Verfahren und Vorrichtung zum flussmittelfreien Aufbringen eines Loetmittels auf ein Substrat oder einen Chip

Flux-free application of solder sphere to substrate or chip - with preliminary treatment/cleaning of the respective surface region, and isolation from surroundings by means of protective gas.
: Azdasht, G.; Lange, M.

Frontpage ()

DE 1995-19544929 A: 19951201
DE 1995-19544929 A: 19951201
DE 19544929 C2: 20010215
Patent, Electronic Publication
Fraunhofer IZM ()

Flux-free application of a solder sphere (102) to a substrate (104) or a chip (108) involves: (a) preliminary treatment and/or cleaning of a region (140) of the surface to be provided with a solder sphere; (b) isolation of the region (140) by means of protective gas from the surroundings; (c) application of a solder sphere to this region. Also claimed is an apparatus for implementation of the method. USE - Used in manufacture of electronic components, for soldering within the so-called fine pitch range. ADVANTAGE - Solder can be applied to substrate or chip surface without use of flux agents.