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Title
Verfahren sowie Vorrichtung zum Zusammenfuehren und Fuegen wenigstens zweier dielektrischer Mikrobauteile
Date Issued
1997
Author(s)
Weisener, T.
Maya, A.
Voegele, G.
Widmann, M.
Bark, C.
Patent No
1995-19545370
Abstract
The method uses controlled handling of the microcomponents via electric fields, with relative positioning of the microcompnents separated from one another via a liquid or gel of relatively low electrical conductivity. One of the microcomponents is fixed in position via the electrical field provided by a holding and positioning electrode device (20), a further microcomponent controlled via a dynamic electrical field, for positioning and fixing relative to the first microcomponent. USE - For assembly of hybrid microsystems, e.g. dielectric motors etc., having dimensions of the order of tenths of millimetres.
Language
de
Patenprio
DE 1995-19545370 A: 19951205