Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Untermetallisierung fuer Lotmaterialien
Submetallization for solder materials
| DE 1995-95071506 A1: 19950301 |
| DE 1995-19528441 A: 19950802 |
| DE 19528441 C2: 19971218 |
| B23K0035 |
|
| German |
| Patent, Electronic Publication |
| Fraunhofer IZM () |
Abstract
An easily producible submetallization layer which can be easily wetted with various solder materials comprises a titanium coating.