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Untermetallisierung fuer Lotmaterialien

Submetallization for solder materials
 
: Zakel, E.; Kallmayer, C.; Nave, J.

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Frontpage ()

DE 1995-95071506 A1: 19950301
DE 1995-19528441 A: 19950802
DE 19528441 C2: 19971218
B23K0035
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
An easily producible submetallization layer which can be easily wetted with various solder materials comprises a titanium coating.

: http://publica.fraunhofer.de/documents/PX-37695.html