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Ultraprecision grinding and single point diamond turning of silicon wafers and their characterization
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1998
Conference Paper
Titel
Ultraprecision grinding and single point diamond turning of silicon wafers and their characterization
Author(s)
Kerstan, M.
Ehlert, A.
Huber, A.
Helmreich, D.
Beinert, J.
Döll, W.
Schinker, M.
Hauptwerk
Proceedings of silicon machining 1998. Spring Topical Meeting
Konferenz
Spring Topical Meeting on Silicon Machining 1998
Language
English
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Fraunhofer-Institut für Werkstoffmechanik IWM