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1997
Conference Paper
Title

Tutorial chip size package

Author(s)
Oppermann, H.H.
Azdasht, G.
Zakel, E.
Reichl, H.
Mainwork
Surface mount technologies, electronic systems & solutions, technologies, circuits & tools, hybrid & advanced packaging technologies 1997. Tagungsband  
Conference
SMT/ES&S/Hybrid 1997  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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