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Thinfilm multichip modules - Process development using photosensitive benzocyclobutane

: Chmiel, G.; Töpper, M.; Jöhren, C.; Achen, A.

Reichl, H.; Heuberger, A.:
Micro-system technologies '94
Berlin; Offenbach: VDE-Verlag, 1994
ISBN: 3-8007-2058-2
Micro System Technologies <1994, Berlin>
Conference Paper
Fraunhofer IZM ()
thin film; multichip module; process development; photosensitive

Used as interlayer dielectric photosensitive BCB combines several beneficial properties of Cyclotene 3022 and other photosensitive polymers such as polyimides. To study the processing parameters inhouse MCM-D demonstators and high frequency test samples were fabricated on Si-Wafers as well as Al2O3-ceramics. The scope of the study covers the basic processing steps such as adhesion promoter, spin coating, prebake, exposure, development and cure in combination with different metallization schemes, such as sputtered Cu, electroplated Cu and Ni:P. The process windows for the various steps were studied. Planarization data are given and the present state of via information and layer build up is shown.