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Thermomechanical simulation of advanced packages in spite of uncertain characteristics

 
: Winkler, T.; Kaulfersch, E.; Schubert, A.; Michel, B.

International Society for Hybrid Microelectronics -ISHM-:
11th European Microelectronics Conference 1997. Proceedings
S.l.: ISHM, 1997
pp.607-609
European Microelectronics Conference <11, 1997, Venice>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-36454.html