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Thermomechanical behavior of metal contacts and interconnects for information technology

 
: Kaulfersch, E.; Schubert, A.; Michel, B.

Schröder, K.-H.:
ICEC '98. 19th International Conference on Electric Contact Phenomena
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2382-4
pp.225-230
International Conference on Electric Contact Phenomena (ICEC) <19, 1998, Nürnberg>
Internationale Tagung über Elektrische Kontakte (ITK) <19, 1998, Nürnberg>
English
Conference Paper
Fraunhofer IZM ()
electrical contact; interconnection; micromechanical devices; semiconductor-metal boundaries

Abstract
The formation of stable and reliable metal-semiconductor contacts is influenced by a variety of physical aspects. The paper reviews some main problems with the focus on mechanical reliability. A number of examples from information technology illustrates the manifold of material combinations applied to form contacts and interconnects in MEMS (Micro Electro Mechanical Systems).

: http://publica.fraunhofer.de/documents/PX-36452.html