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Thermo-mechanical reliability issues of flip chip structures used in DCA and CSP
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1997
Conference Paper
Titel
Thermo-mechanical reliability issues of flip chip structures used in DCA and CSP
Author(s)
Schubert, A.
Dudek, R.
Auersperg, J.
Vogel, D.
Michel, B.
Reichl, H.
Hauptwerk
Area array packaging technologies
Konferenz
Workshop on Flip Chip, CSP and Ball Grid Arrays 1997
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM