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Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method

 
: Schubert, A.; Dudek, R.; Auersperg, J.; Vogel, D.; Michel, B.; Reichl, H.

Suhir, E. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division:
Advances in electronic packaging 1997. Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference. Vol.2
New York/NY.: American Society of Mechanical Engineers, 1997 (EEP 19-2)
ISBN: 0-7918-1559-5
pp.1647-1654
Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) <1997, Kohala Coast/Hawaii>
English
Conference Paper
Fraunhofer IZM ()