Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
| Suhir, E. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division:
Advances in electronic packaging 1997. Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference. Vol.2
New York/NY.: American Society of Mechanical Engineers, 1997 (EEP 19-2)
ISBN: 0-7918-1559-5
pp.1647-1654 |
| Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) <1997, Kohala Coast/Hawaii> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |