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Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
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1997
Conference Paper
Titel
Thermo-mechanical reliability analysis of flip chip assemblies by combined MicroDAC and the Finite Element Method
Author(s)
Schubert, A.
Dudek, R.
Auersperg, J.
Vogel, D.
Michel, B.
Reichl, H.
Hauptwerk
Advances in electronic packaging 1997. Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference. Vol.2
Konferenz
Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) 1997
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM