: Michel, B.; Vogel, D.

Abstract
This paper presents the results of a series of experiments and combined numerical simulations for advanced electronic packaging structures. With growing miniaturization the "local" material properties and local temperature gradients exert a greater influence on the reliability of microcomponents and microsystems than in any macroscopic component. The authors apply such experimental techniques as acousto-microscopy, laser scanning microscopy, thermography, and the microDAC method to characterize the material behaviour of microelectronic packaging components. The experiments have been combined directly with FE simulations. This finally leads to an improved reliability assessment of the microcomponents (e.g. chip cards, airbag sensor components). Special attention is also given to the experimental analysis of thermal fatigue behaviour of solder bumps in microsolder interconnects of flip chip assemblies and chip size packages. These problems are very important for applications in automotive electronics and telecommunication as well.