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  4. Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
 
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1994
Conference Paper
Title

Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method

Abstract
The authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques is presented. Examples deal with the application of experimental methods such as micro moiré technique, speckle pattern photography and x-ray stress analysis in connection with numerical simulations. Problems of solder joint reliability are dealt with.
Author(s)
Dudek, R.
Michel, B.
Mainwork
32nd International Reliability Physics Symposium '94. Proceedings  
Conference
International Reliability Physics Symposium 1994  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • COB-technology

  • electronic packaging

  • FEM

  • finite element analysis

  • laser measuring technology

  • mechanical reliability

  • microsystems

  • SMT

  • stress analysis

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