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Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method

	Institute of Electrical and Electronics Engineers -IEEE-; IEEE Microwave Theory and Techniques Society: 32nd International Reliability Physics Symposium '94. Proceedings 1994 pp.458-465
	International Reliability Physics Symposium <32, 1994, San Jose/Calif.>

	English
	Conference Paper
	Fraunhofer IZM ()
	COB-technology; electronic packaging; FEM; finite element analysis; laser measuring technology; mechanical reliability; microsystems; SMT; stress analysis

Abstract
The authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques is presented. Examples deal with the application of experimental methods such as micro moiré technique, speckle pattern photography and x-ray stress analysis in connection with numerical simulations. Problems of solder joint reliability are dealt with.

: http://publica.fraunhofer.de/documents/PX-36361.html