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  4. Surface micromachined pressure sensors with integrated CMOS read-out electronics
 
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1993
Conference Paper
Title

Surface micromachined pressure sensors with integrated CMOS read-out electronics

Abstract
In this paper a single chip pressure and temperature sensor system with on chip electronics is presented. The capacitive pressure sensor is fabricated using a CMOS process with additional surface micromachining steps to form the membranes. The membrane dimensions have been optimized for a pressure range of 2, 4, 10 and 38 bars, respectively. For the signal processing switched capacitor circuits are used. The sensor signals are converted to a pulse width modulated output signal. The silicon chip has an active area of 3.5 mmü. Between 0xC and 80xC a temperature dependence of less than 200 ppm/xC was found.
Author(s)
Dudaicevs, H.
Kandler, M.
Manoli, Y.
Mokwa, W.
Spiegel, E.
Mainwork
Transducers '93. 7th International Conference on Solid-State Sensors and Actuators. Digest of technical papers  
Conference
International Conference on Solid-State Sensors and Actuators 1993  
Language
English
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Keyword(s)
  • Drucksensor

  • Kondensator-Schalter-Filter

  • Oberflächenmikromechanik

  • pressure sensor

  • Pulsdauermodulation

  • pulse width modulation

  • surface micromachining

  • switched capacitor filter

  • temperature sensor

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