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Structural investigations and indentation testing of aluminium bondpads

Strukturuntersuchungen und Eindruckprüfungen an Aluminium-Bondpads
: Katzer, D.; Petzold, M.; Koch, T.; Grellmann, W.

Michel, B.; Winkler, T. ; Deutscher Verband für Materialforschung und -prüfung e.V. -DVM-, Arbeitskreis Mikrosystemtechnik:
Micro Materials, Micro Mat 1995. Proceedings : Werkstofforschung, Werkstoffprüfung, Werkstoffeinsatz in der Mikrosystemtechnik, 28. - 29.11.1995, Berliner Congress Center, BCC
Berlin: DVM, 1995
pp.521-528 : Ill., Lit.
Conference Micro Materials (Micro Mat) <1, 1995, Berlin>
Conference Paper
Fraunhofer IWM ()

In addition to process parameters and wire properties, also bond pad properties influence the reliability of wire bonding. Particullarly, the bondability is affected by oxide films of varying thickness at the alumina surface. The structural properties of these layers can be investigated by electron microscopy and scanning force microscopy. Oxide films with different thicknesses result also in different deformation properties of the alumina which was demonstrated by microindentation testing.