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1996
Conference Paper
Titel
Steps towards the use of DSPI for high temperature strain measurement
Abstract
This paper describes a systematic study of influences that have to be overcome for the application of interferometry in the high temperature range. A specially designed test facility including an optical arrangement is used for the investigation of CMC specimens. Verification tests are performed up to 1500 deg C with combinded thermal-mechanical load sets. The fringe quality achieved allows to evaluate a field of displacement and strain data. Experimental experience gained is convincing to reach even higher temperatures and to test CMC components as well.