
Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Smart power technology with dielectric insulation. Processes and applications
Abstract
Smart Power processes with dielectric insulation will find a broad range of applications in automotive, industrial or off line circuits. Major insulation technologies are wafer bonding and high dose oxygen implantation. CMOS circuits have been integrated with 60 V - 1000 V power devices, driving currents uo to 10 A.