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AEM investigations of interphases in electrically conductive adhesive joints

: Schäfer, H.; Hennemann, O.-D.; Eys, H. von

7th ISHM-Nordic-Conference '92. Proceedings
International Society for Hybrid Microelectronics (Conference) <7, 1992>
Conference Paper
Fraunhofer IFAM ()
adhesive technology; durability; electrical conductivity; electron microscopy; microelectronics

Increasingly adhesive joining is used to electrically conductive mount SMDs. The long term stability of the adhesive joint is of particular importance. Only the long term stability of adhesive and functional properties of the joint ensures that the assembly performs up to specification. The transition region adhesive-adherent is the crucial factor in determining the long term properties of the joint. Analytical Electron Microscopy (AEM) is a suitable means to investigate this transition region and to contribute to the evaluation of failure mechanisms of assemblies used in the field.