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Advantages of flip technology in millimeter-wave packaging

Vorteile der Flip-Chip-Technologie für die Aufbautechnik im Bereich von Millimeterwellen
: Krems, T.; Haydl, W.H.; Massler, H.; Rüdiger, J.


Koepf, G.A. ; Institute of Electrical and Electronics Engineers -IEEE-:
IEEE MTT-S International Microwave Symposium Digest 1997. Vol.2
Piscataway, NJ: IEEE Publ. Order Dept., 1997
ISBN: 0-7803-3814-6
ISBN: 0-7803-3815-4
pp.987-990 : Ill.
International Microwave Symposium <1997, Denver/Colo.>
Conference Paper
Fraunhofer IAF ()
coplanar waveguide; Flip-Chip-Technologie; flip chip technology; Koplanarleitung; millimeter wave; Millimeterwelle

Power leakage into surface waves in monolithically integrated millimeter-wave circuits is to a great extent determined by the applied packaging technology. In this presentation it is shown that properly designed flip chip packages will not suffer from surface wave leakage. Coplanar waveguides on GaAs substrates are used to demonstrate the decisive differences in the leakage behavior of flip chip mounted MMICs and more conventional MMW packages, featuring surface mounted MMICs connected by wire bonds. All results are based on full wave spectral domain analysis and measurement data in the frequency range from 10 to 120 GHz.