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Simulation of sputter deposition process by DUPSIM

 
: Seifert, M.; Richter, F.; Spallek, R.G.

Baccarani, G.; Rudan, M.; Selberherr, S.; Stippel, H.; Strasser, E.:
Simulation of semiconductor devises and processes : Fifth International Conference on Simulation of Semiconductor Devices and Processes (SISDEP 93), held at the Technical University of Vienna, Austria, September 7 - 9, 1993
Wien: Springer, 1993 (Simulation of semiconductor devices and processes 5)
ISBN: 0-387-82504-5
ISBN: 3-211-82504-5
pp.197-200
International Conference on Simulation of Semiconductor Devices and Processes (SISDEP) <5, 1993, Vienna>
English
Conference Paper
Fraunhofer IMS, Außenstelle Dresden ( IPMS) ()
Abscheidung; DUPSIM; Halbleitertechnologie; Modellsimulation; Simulationsprogramm; simulator

Abstract
A new deposition simulator is presented that allows modeling of sputter deposition processes. Various materials as well as several types of ring shaped magnetron sources can be considered. Some applications are presented to demonstrate the possibilities of the new program. It is part of the two-dimensional process simulator DUPSIM, which is able to simulate many fabrication processes of semiconductor devices in integrated circuits. Thereby a great flexibility and ease of use is reached.

: http://publica.fraunhofer.de/documents/PX-33718.html