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Shear test for adhesion measurement of small structures

 
: Schammler, G.; Buschick, K.; Hahn, R.; Reichl, H.

IEEE Electron Devices Society; IEEE Reliability Society:
International Integrated Reliability Workshop 1996. Final report
Piscataway, NJ: IEEE, 1997
ISBN: 0-7803-3598-8
ISBN: 0-7803-3599-6
pp.31-36
International Integrated Reliability Workshop (IRW) <1996, Lake Tahoe/Calif.>
English
Conference Paper
Fraunhofer IZM ()
adhesion; failure analysis; fracture; life testing; multichip module; polymer film; production testing; sputtering

Abstract
In this study adhesion measurements using shear testing and investigation of the failure mode were carried out. We determined the average shear force of small polyimide structures on metal or oxide surfaces and of metal bumps on sputtered metal layers. Results show clearly, that the type of polyimide has an influence on average shear force for polyimides on metal or oxide surfaces and that sputter conditions can influence the average shear force of the metal layer. The location of fracture is also influenced by the type of combination of polyimide and substrate. Temperature cycling and temperature-humidity testing show a greater influence on average shear force for the polymer specimen than for the sputtered layers. The shear test could be used for occasional monitoring or for routine production monitoring.

: http://publica.fraunhofer.de/documents/PX-33348.html