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Semi-dry method for the manufacture of gypsum-bonded particleboards and their properties in comparison with other inorganically bonded wood-based panels
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1985
Book Article
Title
Semi-dry method for the manufacture of gypsum-bonded particleboards and their properties in comparison with other inorganically bonded wood-based panels
Author(s)
Lempfer, K.
Mainwork
Proceedings of the Symposium on Forest Products Research International - Achievements and the Future. Vol.6
Language
English
Fraunhofer-Institut für Holzforschung Wilhelm-Klauditz-Institut WKI
Keyword(s)
Anwendung
Gipsspanplatte
Halbtrockenverfahren
Verfahrensbeschreibung
Werkstoffeigenschaft
