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Adjustment of Multi-CCD-Chip-Color-Camera Heads

 
: Guyenot, V.; Tittelbach, G.; Palme, M.

Derby, E.A.:
Optomechanical Engineering and Vibration Control
Bellingham, Wash.: SPIE, 1999 (SPIE Proceedings Series 3786)
ISBN: 0-8194-3272-5
pp.402-412
Conference on Optomechanical Design and Engineering <1999, Denver/Colo.>
Conference on Current Developments in Vibration Control for Optomechanical Systems <1999, Denver/Colo.>
English
Conference Paper
Fraunhofer IOF ()
3-CCD-camera; adhesives; adjustment; beam-splitter; camera head; CCD-detector; joining; optical design; positioning

Abstract
The principle of beam-splitter-multi-chip cameras consists in splitting an image into differential multiple images of different spectral ranges and in distributing these onto separate black and white CCD-sensors. The resulting electrical signals from the chips are recombined to produce a high quality color picture on the monitor. Because this principle guarantees higher resolution and sensitivity in comparison to conventional single-chip camera heads, the greater effort is acceptable. Furthermore, multi-chip cameras obtain the complete spectral information for each individual object point while single-chip systems must rely on interpolation. In a joint project, Fraunhofer IOF and STRACON GmbH and in future COBRA electronic GmbH develop methods for designing the optics and dichroitic mirror systems of such prism color beam splitter devices. Additionally, techniques and equipment for the alignment and assembly of color beam splitter-multi-CCD-devices on the basis of gluing with UV-curabl e adhesives have been developed, too.

: http://publica.fraunhofer.de/documents/PX-3304.html