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Schichten charakterisieren

: Sklarczyk, C.; Netzelmann, U.; Ehlen, F.

Materialprüfung 40 (1998), No.4, pp.149-153
ISSN: 0025-5300
Journal Article
Fraunhofer IZFP ()
berührungslos; contactless; layer; microwave; Mikrowelle; Mikrowellenverfahren; Schicht; zerstörungsfreie Prüfung

Nondestructive and Contactless Characterization of Layers: Dielectric materials and materials with low conductivity consisting of multiple layers as well as coatings can be characterized nondestructively and contactless by means of microwaves in transmission and reflection. Measuring quantities which can be determined are e.g. layer thciness, permittivity, porosity or moisture. The thickness of the dielectric layers should not be much smaller than one wave length. However, in some dases semiconducting and metaalic layers can be characterized if the thickness is much smaller than the wave length. In increasing extent low-priced and highly integrated microwave components are available for that purpose.