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Adaption des Flexibilitätsmodells zur Risikobetrachtung - Analyse von Simulationsszenarien

Analyzing Flexibility vs. Cost for Simulated Release Profiles of a Multiple Product Waferfab
: Sturm, R.

Meissner & Wurst GmbH; Submicron Semiconductor Technologies GmbH; Jenoptik AG, Jena; Fraunhofer-Institut für Integrierte Schaltungen -IIS-, Erlangen; Fraunhofer-Institut für Produktionstechnik und Automatisierung -IPA-, Stuttgart; Thesys Gesellschaft für Mikroelektronik, Erfurt:
Smart Fabrication Flexible Fab 1999 : 3. Offener Workshop, 27./28.1.1999 in Tabarz/Thüringen
Workshop Smart Fabrication Flexible Fab <3, 1999, Tabarz/Thüringen>
Conference Paper
Fraunhofer IPA ()
Fertigung; Flexibilität; Halbleiter; Kosten; Risiko-Analyse; simulation; wafer fabrication

In the course of the Smart Fabrication Flexible Fab project a risk assessment model was developed to analyze different wafer start profiles of different process flows in regard to cost and flexibility. The simulation analysis of various order release scenarios was performed with AutoSimulations' ASAP software. Simulation results generated with different wafer release profiles were evaluated in regard to t he required flexibility fulfillment through an especially developed evaluation instrument. Important key parameters such as cycle time distribution, on time delivery performance and line utilization were taken into account. Within a Philips SMST cost tool the manufacturing costs of each scenario were determined and compared to the congruent flexibility account. This approach was created to analyze beforehand various manufacturing scenarios, which could be medium- or long-term manufactured in a multiple product wafer fab. This method can be applied to optimize an already existing multi ple product manufacturing or to evaluate different manufacturing scenarios in a fab planning process.