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1994
Conference Paper
Title

Residual stress analysis in components of microsystems

Other Title
Eigenspannungsanalyse in Mikrosystem-Komponenten
Abstract
In this paper, different kinds of residual stresses during the manufacture of microsystems and microdevices, their origins and effects as well as various measuring techniques are reviewed. X-ray diffraction is a suitable and well-known non-destructive method of analysing residual stresses. This technique, however, has not always been compatible for use on these microsystems due to the geometrical requirements and the long time needed for the measurements. The subject of the paper is to demonstrate the feasibility and to discuss the pros and cons of this method in this situation.
Author(s)
Schubert, A.
Michel, B.
Mainwork
Micro-system technologies '94  
Conference
International Conference on Micro Electro, Opto, Mechanic Systems and Components 1994  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • Eigenspannung

  • FEM-calculation

  • microsystems

  • Mikrosysteme

  • residual stress

  • Spannung und Textur

  • stress and texture

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