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Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substrates

 
: Klöser, J.; Zakel, E.; Bechtold, F.; Reichl, H.

Institute of Electrical and Electronics Engineers -IEEE-:
ECTC '95. 45th IEEE electronic components and technology conference. Proceedings
1995
pp.1179-1190
IEEE Electronic Components and Technology Conference <45, 1995, Las Vegas>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-31703.html