• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. Reliability investigations of different bumping processes for flip chip and TAB applications
 
  • Details
  • Full
Options
1996
Conference Paper
Title

Reliability investigations of different bumping processes for flip chip and TAB applications

Abstract
Presently, a number of bump metallurgies are used for flip chip and TAB technology. However, no conclusive characterisation of the processes used and reliability obtained is available up to now. For wafer bumping, alloys of electroplated PbSn5, PbSn63, AuSn20 and metals like Au are used as well as electroless Ni(P)-Au deposition. Flexible bumping processes like Au stud bumping and mechanical bumping with PbSn solders on a solder wettable UBM are evaluated as alternatives, which are of essential importance for flip chip or TAB especially for small and medium volume applications. Reliability investigations on these used metallurgies are performed. The mechanical stability of the bumps is tested after thermal cycling, taking special care in the determination of the failure mode. Finally, the results are characterized, compared and evaluated.
Author(s)
Jung, E.
Klöser, J.
Nave, J.
Engelmann, G.
Dietrich, L.
Zakel, E.
Reichl, H.
Mainwork
Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium 1996. Proceedings  
Conference
International Electronics Manufacturing Technology Symposium (IEMT) 1996  
DOI
10.1109/IEMT.1996.559743
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • flip-chip devices

  • lead bonding

  • reliability

  • Soldering

  • tape automated bonding

  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024