Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Reliability evaluation of chip scale packages by FEA and MicroDAC
| Mahidhara, R.K. ; ASM International, Flow and Fracture Committee; The Minerals, Metals and Materials Society -TMS-, Warrendale/Pa.:
Design and reliability of solders and solder interconnections 1997. Proceedings of a symposium held during the TMS Annual Meeting
Warrendals,Pa.: Minerals, Metals and Materials Society, 1997
ISBN: 0-87339-354-6
pp.439-445 |
| Solder Joint Symposium <1997, Orlando/Fla.>
TMS Annual Meeting <1997, Orlando/Fla.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |