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  4. Reduction of heat loss of silicon membranes by the use of trench etching techniques
 
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1993
Conference Paper
Title

Reduction of heat loss of silicon membranes by the use of trench etching techniques

Author(s)
Werno, J.
Mokwa, W.
Vogt, H.
Kersjes, R.A.
Mainwork
Eurosensors VII. Book of Abstracts  
Conference
Eurosensors 1993  
Language
English
Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS  
Keyword(s)
  • electronic device

  • elektronisches Gerät

  • heat loss

  • Membran

  • membrane

  • Meßaufnehmer

  • microsystem

  • Mikrosystemtechnik

  • sensing element

  • silicium

  • silicon

  • Substrat

  • substrate

  • thermal insulation

  • Wärmeisolation

  • Wärmeverlust

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