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Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

 

Institutet för Verkstadsteknisk Forskning -IVF-, Göteborg/Mölndal; IEEE Components, Packaging, and Manufacturing Technology Society:
First IEEE International Symposium on Polymeric Electronics Packaging 1997. Proceedings
Piscataway, NJ.: IEEE, 1997
ISBN: 0-7803-3865-0
ISBN: 0-7803-3866-9
ISBN: 91-630-6052-0
International Symposium on Polymeric Electronics Packaging (PEP) <1, 1997, Norrköping>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-31171.html