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Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology
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1997
Conference Paper
Titel
Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology
Author(s)
Becker, K.-F.
Ansorge, F.
Ehrlich, R.
Azdasht, G.
Bader, V.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
First IEEE International Symposium on Polymeric Electronics Packaging 1997. Proceedings
Konferenz
International Symposium on Polymeric Electronics Packaging (PEP) 1997
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM