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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology

 

Semiconductor Technology Center, Inc.:
Third International Assembly and Packaging Foundry Conference 1997. Proceedings
Neffs/Pa.: Semiconductor Technology Center, 1997
International Assembly and Packaging Foundry Conference (APCON) <3, 1997, Sunnyvale/Calif)
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-31170.html