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  4. Radiation detection using integrated GaAs HEMT electronics
 
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1996
Journal Article
Title

Radiation detection using integrated GaAs HEMT electronics

Other Title
Strahlungsmessung mit integrierter GaAs-HEMT-Elektronik
Abstract
A charge sensitive preamplifier (CSP) together with a shaper was integrated using the standard 0.3 mu m GaAs HEMT process of the "Fraunhofer-Institut für Angewandte Festkörperphysik" (IAF) on a 100 x 1000 mu m(exp 2) large chip area. The shaper has a filter time constant tau f = 10 ns to minimize the noise of the CSP, which was measured to be 450 rms electrons at an input capacitance CT = 1.55 pF. The circuit is operated with negative supply voltages of -3.5 and -4.5 V giving a total power dissipation of 20 mW. The overall amplification into 50 ohm is 18.8 mV/fC, corresponding to a 75 mV output signal for a charge of 25 000 electrons, which is the signal generated by 1 minimum ionizing particle (MIP) in a 200 mu m thick GaAs or 300 gm thick Si detector. To demonstrate the functionality of a fully GaAs based detection system the chip was wire-bonded to a GaAs pad detector and used at the T10 testbeam facility of the PS accelerator at CERN to record spectra of 5 GeV pions.
Author(s)
Lauxtermann, S.
Bronner, Wolfgang  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Ludwig, J.
Runge, K.
Journal
Nuclear instruments and methods in physics research, Section A. Accelerators, spectrometers, detectors and associated equipment  
DOI
10.1016/0168-9002(96)00643-2
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • HEMT

  • radiation detection

  • sensor electronics

  • Sensorelektronik

  • Strahlungsmessung

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