Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Processing of Teflon AF 1601 for application as dielectric in high frequency multilayer metallizations for MCM-D
| Deutscher Verband für Schweißtechnik e.V. -DVS-, Düsseldorf:
EuPac '98. 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics. Lectures and poster
Düsseldorf: DVS-Verlag, 1998 (DVS-Berichte 191)
ISBN: 3-87155-497-9 |
| European Conference on Electronic Packaging Technology (EuPac) <3, 1998, Nürnberg>
International Conference on Interconnection Technology in Electronics <9, 1998, Nürnberg> |
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| English |
| Conference Paper |
| Fraunhofer ISIT () |