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Plasma-enhanced chemical vapour deposition of thin films by corona discharge at atmospheric pressure

: Thyen, R.; Weber, A.; Klages, C.-P.

Plasma surface engineering 1996. Proceedings of the 5th International Conference on Plasma Surface Engineering
Garmisch-Partenkirchen, 1996
International Conference on Plasma Surface Engineering <5, 1996, Garmisch-Partenkirchen>
Conference Paper
Fraunhofer IST ()
amorphous hydrogenated carbon; contact angle; corona discharge; dielectric barrier discharge; fuorine carbon coating; plasma-enhanced chemical vapour deposition; secondary ion mass spectroscopy; silicon oxide coating; surface energy; Thin film deposition

Corona discharges (also called dielectric barrier discharges or silent discharges consisting of small localised microdischarges at or near atmospheric pressure are used for the reactive deposition of organic and inorganic thin films. Inorganic SiOx thin films were deposited with tetramethylsilane (TMS, Si[CH3]4) or tretraethylortosilicate (TEOS, Si[OC2H5]4) in oxygen containing atmospheres. In inert argon/nitrogen atmospheres TMS formed plasmapolymer-like hydrogenated silicon carbon coatings (SiC:H). Hydrocarbons like methane (CH4), ethine (C2H2) or propargylalcohol (HC2CH2OH) as monomers lead to polymer-like amorphous hydrogenated carbon coatings (a-C:H). With tetrafluoroethene (C2F4) teflon like carbon coatings (a-C:F) were deposited. Surface energies between 16 and 66 mN/m on silicon and between 16 and 62 mN/m on polypropylene were obtained depending on the film composition.