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1996
Conference Paper
Title

Plasma assisted wave soldering

Abstract
For many years, wave soldering has been used as a production technology in the electronics industry. A flux was always used to make soldering of devices and circuit boards possible. This paper presents a process step for improvement of the solderability of contact areas by low frequency plasma which makes the application of flux or activators completely unnecessary for wave soldering with an inert gas atmosphere.
Author(s)
Scheel, W.
Mainwork
Surface Mount International. Advanced electronics manufacturing technologies 1996. Proceedings of the technical program  
Conference
Surface Mount International (SMI) 1996  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • assembling

  • plasma applications

  • printed circuit manufacture

  • surface mount technology

  • surface treatment

  • wave soldering

  • wetting

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