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Picosecond laser ablation of thin copper films

 

Applied physics. A 63 (1996), pp.117-121
ISSN: 0340-3793
ISSN: 0721-7250
ISSN: 0947-8396
English
Journal Article
Fraunhofer ILT ()
ablation process; electron population; laser radiation; microsecond laser; picosecond pulses; time-of-flight spectroscopy; ultrafast laser heating

Abstract
The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated to F(ind thres) = 171 mJ/cm(exp 2). The ablation rate per pulse is measured as a function of intensity in the range of 5 x 10(exp 9) to 2 x 10(exp 11) W/cm(exp 2) and changes front 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for Ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed.

: http://publica.fraunhofer.de/documents/PX-28528.html