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Novel packaging concept for high power multichip modules

 
: Hahn, R.; Töpper, M.; Reichl, H.

Future fab international (1998), pp.385-391
ISSN: 1363-5182
English
Journal Article
Fraunhofer IZM ()

Abstract
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microelectronics packaging volume. However, this integration results in higher heat flux densities in the package. Considerable effort has been made during the last years to develop cooling concepts with a very low thermal resistance, particularly in high end applications (super-computers, mainframes and workstations). This paper describes a novel packaging technology for high power multi chip modules (MCMs).

: http://publica.fraunhofer.de/documents/PX-26588.html