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Novel microstructuring technologies in silicon

: Hillerich, B.; Pradel, H.; Schaber, U.; Vogel, S.

Reichl, H.; Obermeier, E. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '98
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2421-9
pp.427-432 : Ill., Lit.
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <6, 1998, Potsdam>
Conference Paper
Fraunhofer IFT; 2000 dem IZM eingegliedert

Two microstructuring processes are described in the paper: A high performance RIE process (STS Advanced Silicon Etch), which is in many cases a benefical replacement for conventional, anisotropic silicon etch techniques. Furthermore a technology using porous silicon as sacrificial layer in a surface micromachining process. Porous silicon has some favourable properties, compared to other sacrificial layers as layer thickness up to 100mu m. The capabilities of these processes are illustrated by several of MEMS applications carried out at the Fraunhofer Institute for Solid State Technology.