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A new production line for low cost flip chip assembly
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1997
Conference Paper
Titel
A new production line for low cost flip chip assembly
Author(s)
Kutzner, K.
Kloeser, J.
Kappeler, U.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
Area array packaging technologies
Konferenz
Workshop on Flip Chip, CSP and Ball Grid Arrays 1997
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM