: Risse, S.; Peschel, T.; Damm, C.; Kirschstein, U.

Abstract
In the next few years a new chip-generation with structure sizes well below 100 run and high complexity will require novel, so-called "future lithography" processes. One of these new technologies is the Ion Projection Lithography. Within the framework of a large European project lead by SIEMENS, the necessary technologies are developed and the first pilot system will be built. In this system, one of the most important units is a high precision wafer stage. The heart of the stage system is the so-called metrology - plate with integrated electrostatic wafer chuck and handling unit. The design of this novel stage system is described in this contribution. Extensive FEM-simulations form the basis of the present design. All major components are made from glass-ceramics to guarantee the highest possible thermal and mechanical stability. Not only in the field of lithography many modem precision mechanical systems require position tolerances in the submicrometer and seconds of arc ranges. Stron g system solutions can be developed by the effort of glass-ceramics and new and traditional manufachiring processes.