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A new CSP-technology based on chip on flex

 
: Azdasht, G.; Jung, E.; Zakel, E.; Reichl, H.

Semiconductor Technology Center, Inc.:
Second International Conference on Chip Scale Packaging 1997. Proceedings
Neffs/Pa.: Semiconcuctor Technology Center, 1997
International Conference on Chip Scale Packaging (CHIPCON) <2, 1997, Sunnyvale/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/PX-26118.html