: Gramann, U.; Frauenhoffer, F.; Sturm, R.; Matuscheck, P.; Suntrup, M.; Kaufmann, T.S.; Schäfer, W.

Abstract
During the last years, especially in Europe, tendencies towards small lot production, multiple product variations of electronic products and hybrid microsystems with high quality and reliability can be recognised. Consequently, new concepts in controlled equipment for an economic production in electronics packaging are required. The Fraunhofer IPA depicts objectives of software-based generic and specific equipment models for communication purposes at process and measurement equipment. Characteristics and possible benefits by using standards such as SEMI's Semiconductor Equipment Standards and Models are illustrated. Faster gathering of quality data, increased yield rates, higher cost transparency of the manufacturing process and improved productivity is achieved, among others, by using efficient information technology systems. An exemplary new information concept for the data exchange between a wire bonder and a pull tester was developed a the Fraunhofer IPA. It has been shown that the quality data of the assembly process can be automatically extracted by a manufacturing execution system. The connection to higher information systems such as production planning systems is likewise feasible. With this concept, the overall manufacturing performance can be improved significantly.