English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
A new approach to chip size package using meniscus soldering and FPC-bonding
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1997
Conference Paper
Title
A new approach to chip size package using meniscus soldering and FPC-bonding
Author(s)
Kallmayer, C.
Jung, E.
Kasulke, P.
Azadeh, R.
Azdasht, G.
Zakel, E.
Reichl, H.
Mainwork
47th Electronic Components and Technology Conference 1997. Proceedings
Conference
Electronic Components and Technology Conference (ECTC) 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM