Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. A new approach to chip size package using meniscus soldering and FPC-bonding
| Electronic Industries Association -EIA-; IEEE Components, Packaging, and Manufacturing Technology Society:
47th Electronic Components and Technology Conference 1997. Proceedings
Piscataway/N.J.: IEEE Order Department, 1997
ISBN: 0-7803-3857-X |
| Electronic Components and Technology Conference (ECTC) <47, 1997, San Jose/Calif.> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |