• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Konferenzschrift
  4. A new approach to chip size package using meniscus soldering and FPC-bonding
 
  • Details
  • Full
Options
1997
Conference Paper
Title

A new approach to chip size package using meniscus soldering and FPC-bonding

Author(s)
Kallmayer, C.
Jung, E.
Kasulke, P.
Azadeh, R.
Azdasht, G.
Zakel, E.
Reichl, H.
Mainwork
47th Electronic Components and Technology Conference 1997. Proceedings  
Conference
Electronic Components and Technology Conference (ECTC) 1997  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024