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A multichip module integration technology on silicon substrate for high frequency applications
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1998
Conference Paper
Title
A multichip module integration technology on silicon substrate for high frequency applications
Author(s)
Mangold, T.
Gulde, P.
Neumann, G.
Russer, P.
Mainwork
Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems 1998. Digest of papers
Conference
Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems 1998
DOI
10.1109/SMIC.1998.750217
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT
